Tool and method for the thermal transient evaluation of packages

Vladimir Szekely, Marta Rencz, Bernard Courtois

Research output: Conference article

Abstract

This paper presents a new concept for the thermal transient measurement of IC packages. The TTMK thermal transient test kit described here consists of a test chip, a dedicated software running on a PC and a special cable connecting the PC to the IC package which encapsulates the test chip. The function of the thermal transient test equipment is realized partly by the test chip itself and partly by the measuring software. The software performs both the control of the measurement and the evaluation of the results. The output of the evaluation software may be a compact model network or the structure function describing the properties of the heat conduction path. The use of the TTMK kit and the capabilities of the evaluation software are presented in the paper.

Original languageEnglish
Pages (from-to)94-103
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3893
Publication statusPublished - dec. 1 1999
EventProceedings of the 1999 Design, Characterization, and Packaging for MEMS and Microelectronics - Royal Pines Resort, Aust
Duration: okt. 27 1999okt. 29 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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