To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’17

Lorenzo Codecasa, M. Rencz

Research output: Editorial

Original languageEnglish
Number of pages1
JournalMicroelectronics Reliability
Volume91
DOIs
Publication statusPublished - dec. 1 2018

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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