Thermomechanical analysis of hotplates by FEM

Zs Vízváry, P. Fürjes, I. Bársony

Research output: Article

2 Citations (Scopus)

Abstract

This paper deals with the finite element model for the three-dimensional analysis of thermally isolated hotplates. These hotplates can be used as gas sensors. Our calculations result in the temperature distribution, the stress and displacement field. The stress and displacement fields are calculated from the thermal results (coupled analysis). Calculations were made in different cases of boundary conditions. The results were discussed with respect to the initial experimental findings. The problem is very difficult, hence the present results are qualitative and further examination is needed.

Original languageEnglish
Pages (from-to)833-837
Number of pages5
JournalMicroelectronics Journal
Volume32
Issue number10-11
DOIs
Publication statusPublished - okt. 2001

Fingerprint

stress distribution
Finite element method
dimensional analysis
Chemical sensors
Temperature distribution
temperature distribution
examination
Boundary conditions
boundary conditions
sensors
gases
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Thermomechanical analysis of hotplates by FEM. / Vízváry, Zs; Fürjes, P.; Bársony, I.

In: Microelectronics Journal, Vol. 32, No. 10-11, 10.2001, p. 833-837.

Research output: Article

@article{f52f2641def942ca8df6398ea0e6dbae,
title = "Thermomechanical analysis of hotplates by FEM",
abstract = "This paper deals with the finite element model for the three-dimensional analysis of thermally isolated hotplates. These hotplates can be used as gas sensors. Our calculations result in the temperature distribution, the stress and displacement field. The stress and displacement fields are calculated from the thermal results (coupled analysis). Calculations were made in different cases of boundary conditions. The results were discussed with respect to the initial experimental findings. The problem is very difficult, hence the present results are qualitative and further examination is needed.",
keywords = "Finite element method, Gas sensors, Thermomechanical analysis",
author = "Zs V{\'i}zv{\'a}ry and P. F{\"u}rjes and I. B{\'a}rsony",
year = "2001",
month = "10",
doi = "10.1016/S0026-2692(01)00070-2",
language = "English",
volume = "32",
pages = "833--837",
journal = "Microelectronics",
issn = "0026-2692",
publisher = "Elsevier Limited",
number = "10-11",

}

TY - JOUR

T1 - Thermomechanical analysis of hotplates by FEM

AU - Vízváry, Zs

AU - Fürjes, P.

AU - Bársony, I.

PY - 2001/10

Y1 - 2001/10

N2 - This paper deals with the finite element model for the three-dimensional analysis of thermally isolated hotplates. These hotplates can be used as gas sensors. Our calculations result in the temperature distribution, the stress and displacement field. The stress and displacement fields are calculated from the thermal results (coupled analysis). Calculations were made in different cases of boundary conditions. The results were discussed with respect to the initial experimental findings. The problem is very difficult, hence the present results are qualitative and further examination is needed.

AB - This paper deals with the finite element model for the three-dimensional analysis of thermally isolated hotplates. These hotplates can be used as gas sensors. Our calculations result in the temperature distribution, the stress and displacement field. The stress and displacement fields are calculated from the thermal results (coupled analysis). Calculations were made in different cases of boundary conditions. The results were discussed with respect to the initial experimental findings. The problem is very difficult, hence the present results are qualitative and further examination is needed.

KW - Finite element method

KW - Gas sensors

KW - Thermomechanical analysis

UR - http://www.scopus.com/inward/record.url?scp=0035480073&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035480073&partnerID=8YFLogxK

U2 - 10.1016/S0026-2692(01)00070-2

DO - 10.1016/S0026-2692(01)00070-2

M3 - Article

AN - SCOPUS:0035480073

VL - 32

SP - 833

EP - 837

JO - Microelectronics

JF - Microelectronics

SN - 0026-2692

IS - 10-11

ER -