Abstract
In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.
| Original language | English |
|---|---|
| Title of host publication | Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
| Pages | 50-54 |
| Number of pages | 5 |
| Volume | 20 |
| Publication status | Published - 2004 |
| Event | 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004 - San Jose, CA., United States Duration: márc. 9 2004 → márc. 11 2004 |
Other
| Other | 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004 |
|---|---|
| Country | United States |
| City | San Jose, CA. |
| Period | 3/9/04 → 3/11/04 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Instrumentation
Cite this
Structure function evaluation of stacked dies. / Rencz, M.; Székely, V.
Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Vol. 20 2004. p. 50-54.Research output: Conference contribution
}
TY - GEN
T1 - Structure function evaluation of stacked dies
AU - Rencz, M.
AU - Székely, V.
PY - 2004
Y1 - 2004
N2 - In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.
AB - In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.
KW - Die attach quality
KW - Reliability testing
KW - Structure function
KW - Thermal transient testing
UR - http://www.scopus.com/inward/record.url?scp=2342646748&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=2342646748&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:2342646748
VL - 20
SP - 50
EP - 54
BT - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ER -