Short time die attach characterization of leds for in-line testing application

P. Szabó, M. Rencz, G. Farkas, A. Poppe

Research output: Conference contribution

15 Citations (Scopus)

Abstract

The qualification of the the attach of Light Emitting Diodes (LED) is a very important element of predicting the reliability of the package, as the temperature of the chip is strongly affected by the quality of the the attach. LED manufacturers are seeking for stations to be able to test the attach quality in mass production. This paper describes our findings regarding LED package testing with a focus on the attach quality testing, necessiating short measurement times only. Requirements agains the physical testing and the further processing are shown, based on our experimental findings.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages360-366
Number of pages7
DOIs
Publication statusPublished - dec. 1 2006
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: dec. 6 2006dec. 8 2006

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period12/6/0612/8/06

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Szabó, P., Rencz, M., Farkas, G., & Poppe, A. (2006). Short time die attach characterization of leds for in-line testing application. In 2006 8th Electronics Packaging Technology Conference, EPTC (pp. 360-366). [4147272] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2006.342743