Selective electrochemical etching for the investigation of solder joint microstructures

Attila Bonyár, Tamás Hurtony, Gábor Harsányi

Research output: Conference contribution

4 Citations (Scopus)

Abstract

Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.

Original languageEnglish
Title of host publicationISSE 2012 - 35th International Spring Seminar on Electronics Technology
Subtitle of host publication"Power Electronics", Conference Proceedings
Pages89-94
Number of pages6
DOIs
Publication statusPublished - okt. 9 2012
Event35th International Spring Seminar on Electronics Technology: Power Electronics, ISSE 2012 - Bad Aussee, Austria
Duration: máj. 9 2012máj. 13 2012

Publication series

NameProceedings of the International Spring Seminar on Electronics Technology
ISSN (Print)2161-2528
ISSN (Electronic)2161-2536

Other

Other35th International Spring Seminar on Electronics Technology: Power Electronics, ISSE 2012
CountryAustria
CityBad Aussee
Period5/9/125/13/12

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Bonyár, A., Hurtony, T., & Harsányi, G. (2012). Selective electrochemical etching for the investigation of solder joint microstructures. In ISSE 2012 - 35th International Spring Seminar on Electronics Technology: "Power Electronics", Conference Proceedings (pp. 89-94). [6273114] (Proceedings of the International Spring Seminar on Electronics Technology). https://doi.org/10.1109/ISSE.2012.6273114