Package characterization: Simulations or measurements?

András Poppe, Andras Vass-Varnai, Gábor Farkas, Marta Rencz

Research output: Conference contribution

12 Citations (Scopus)

Abstract

As the functionality of thermal simulators gets more and more complex, measurement techniques also improve. Thermal engineers face and increasingly difficult task to make the right selection from the existing tools. In this paper the applicability of the JEDEC JESD 51-1 static measurement method is compared to mainstream simulation tools, especially MCAD or EDA embedded CFD solutions. Both techniques are opposed to each other in terms of required time and other expense factors. In this paper we discuss when different aspects of trade-offs to be made between thermal simulation and physical testing.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages155-160
Number of pages6
DOIs
Publication statusPublished - dec. 1 2008
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: dec. 9 2008dec. 12 2008

Publication series

Name10th Electronics Packaging Technology Conference, EPTC 2008

Other

Other10th Electronics Packaging Technology Conference, EPTC 2008
CountrySingapore
CitySingapore
Period12/9/0812/12/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Poppe, A., Vass-Varnai, A., Farkas, G., & Rencz, M. (2008). Package characterization: Simulations or measurements? In 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 155-160). [4763427] (10th Electronics Packaging Technology Conference, EPTC 2008). https://doi.org/10.1109/EPTC.2008.4763427