Mechanical stress induced whiskers

Barbara Horváth, G. Harsányi

Research output: Conference contribution

1 Citation (Scopus)

Abstract

Electroplated tin surfaces grow whiskers easily and mechanical loads tend to accelerate this. Our aim was to define how the different kinds of mechanical loads induce the growth of tin whiskers. We have applied 3 types of mechanical loads on component leads covered by either electroplated tin or electroplated tin with silver underlayer. The method of testing was pressing perpendicularly three types of heads on the two types of layers, all equally with 3Nforce for 400 hours. These types ofhead shapes were: spear (60° ), pointed (30° ), round (r = 250 11m). The observed results have shown that different mechanical defects induce the growth ofwhiskers in different ways and using underlayers have also changed the amount of whiskers grown on the surface in case of using the same needle shape andforce.

Original languageEnglish
Title of host publicationSIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages
Pages389-393
Number of pages5
DOIs
Publication statusPublished - 2009
Event15th International Symposium for Design and Technology of Electronics Packages, SIITME 2009 - Gyula, Hungary
Duration: szept. 17 2009szept. 20 2009

Other

Other15th International Symposium for Design and Technology of Electronics Packages, SIITME 2009
CountryHungary
CityGyula
Period9/17/099/20/09

Fingerprint

Tin
Needles
Silver
Defects
Testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Horváth, B., & Harsányi, G. (2009). Mechanical stress induced whiskers. In SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages (pp. 389-393). [5407337] https://doi.org/10.1109/SIITME.2009.5407337

Mechanical stress induced whiskers. / Horváth, Barbara; Harsányi, G.

SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages. 2009. p. 389-393 5407337.

Research output: Conference contribution

Horváth, B & Harsányi, G 2009, Mechanical stress induced whiskers. in SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages., 5407337, pp. 389-393, 15th International Symposium for Design and Technology of Electronics Packages, SIITME 2009, Gyula, Hungary, 9/17/09. https://doi.org/10.1109/SIITME.2009.5407337
Horváth B, Harsányi G. Mechanical stress induced whiskers. In SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages. 2009. p. 389-393. 5407337 https://doi.org/10.1109/SIITME.2009.5407337
Horváth, Barbara ; Harsányi, G. / Mechanical stress induced whiskers. SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages. 2009. pp. 389-393
@inproceedings{9fda2bc7cfbb4b8081dcffa1cc425630,
title = "Mechanical stress induced whiskers",
abstract = "Electroplated tin surfaces grow whiskers easily and mechanical loads tend to accelerate this. Our aim was to define how the different kinds of mechanical loads induce the growth of tin whiskers. We have applied 3 types of mechanical loads on component leads covered by either electroplated tin or electroplated tin with silver underlayer. The method of testing was pressing perpendicularly three types of heads on the two types of layers, all equally with 3Nforce for 400 hours. These types ofhead shapes were: spear (60° ), pointed (30° ), round (r = 250 11m). The observed results have shown that different mechanical defects induce the growth ofwhiskers in different ways and using underlayers have also changed the amount of whiskers grown on the surface in case of using the same needle shape andforce.",
author = "Barbara Horv{\'a}th and G. Hars{\'a}nyi",
year = "2009",
doi = "10.1109/SIITME.2009.5407337",
language = "English",
isbn = "9781424451333",
pages = "389--393",
booktitle = "SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages",

}

TY - GEN

T1 - Mechanical stress induced whiskers

AU - Horváth, Barbara

AU - Harsányi, G.

PY - 2009

Y1 - 2009

N2 - Electroplated tin surfaces grow whiskers easily and mechanical loads tend to accelerate this. Our aim was to define how the different kinds of mechanical loads induce the growth of tin whiskers. We have applied 3 types of mechanical loads on component leads covered by either electroplated tin or electroplated tin with silver underlayer. The method of testing was pressing perpendicularly three types of heads on the two types of layers, all equally with 3Nforce for 400 hours. These types ofhead shapes were: spear (60° ), pointed (30° ), round (r = 250 11m). The observed results have shown that different mechanical defects induce the growth ofwhiskers in different ways and using underlayers have also changed the amount of whiskers grown on the surface in case of using the same needle shape andforce.

AB - Electroplated tin surfaces grow whiskers easily and mechanical loads tend to accelerate this. Our aim was to define how the different kinds of mechanical loads induce the growth of tin whiskers. We have applied 3 types of mechanical loads on component leads covered by either electroplated tin or electroplated tin with silver underlayer. The method of testing was pressing perpendicularly three types of heads on the two types of layers, all equally with 3Nforce for 400 hours. These types ofhead shapes were: spear (60° ), pointed (30° ), round (r = 250 11m). The observed results have shown that different mechanical defects induce the growth ofwhiskers in different ways and using underlayers have also changed the amount of whiskers grown on the surface in case of using the same needle shape andforce.

UR - http://www.scopus.com/inward/record.url?scp=77949292606&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77949292606&partnerID=8YFLogxK

U2 - 10.1109/SIITME.2009.5407337

DO - 10.1109/SIITME.2009.5407337

M3 - Conference contribution

AN - SCOPUS:77949292606

SN - 9781424451333

SP - 389

EP - 393

BT - SIITME 2009 - 15th International Symposium for Design and Technology of Electronics Packages

ER -