Laser soldering of flip-chips

K. Kordás, A. Pap, G. Tóth, M. Pudas, J. Jääskeläinen, A. Uusimäki, J. Vähäkangas

Research output: Article

15 Citations (Scopus)

Abstract

A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer of additional solder paste. The aligned samples (solder pad - solder paste - chip bump) were illuminated through the glass substrate using an Ar+ laser beam (λ=488nm, P=0.6-3.0W, d=100μm at 1/e) to heat the printed pad and melt the solder paste, thus forming a joint between the printed pad and the chip bump. The heat-affected zone was modeled using computer-assisted finite element method. The solder joint cross-sections were analyzed using optical and electron microscopy as well as energy dispersive X-ray element analyses. The laser-soldered joints were of good mechanical and electrical quality and the process proved to be suitable for manufacturing customized circuit prototypes.

Original languageEnglish
Pages (from-to)112-121
Number of pages10
JournalOptics and Lasers in Engineering
Volume44
Issue number2
DOIs
Publication statusPublished - febr. 2006

Fingerprint

soldering
Soldering
solders
Soldering alloys
chips
Ointments
Lasers
lasers
soldered joints
Soldered joints
Offset printing
Glass
heat affected zone
rollers
glass
printed circuits
circuit boards
Heat affected zone
Silver
printing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

Cite this

Kordás, K., Pap, A., Tóth, G., Pudas, M., Jääskeläinen, J., Uusimäki, A., & Vähäkangas, J. (2006). Laser soldering of flip-chips. Optics and Lasers in Engineering, 44(2), 112-121. https://doi.org/10.1016/j.optlaseng.2005.03.002

Laser soldering of flip-chips. / Kordás, K.; Pap, A.; Tóth, G.; Pudas, M.; Jääskeläinen, J.; Uusimäki, A.; Vähäkangas, J.

In: Optics and Lasers in Engineering, Vol. 44, No. 2, 02.2006, p. 112-121.

Research output: Article

Kordás, K, Pap, A, Tóth, G, Pudas, M, Jääskeläinen, J, Uusimäki, A & Vähäkangas, J 2006, 'Laser soldering of flip-chips', Optics and Lasers in Engineering, vol. 44, no. 2, pp. 112-121. https://doi.org/10.1016/j.optlaseng.2005.03.002
Kordás K, Pap A, Tóth G, Pudas M, Jääskeläinen J, Uusimäki A et al. Laser soldering of flip-chips. Optics and Lasers in Engineering. 2006 febr.;44(2):112-121. https://doi.org/10.1016/j.optlaseng.2005.03.002
Kordás, K. ; Pap, A. ; Tóth, G. ; Pudas, M. ; Jääskeläinen, J. ; Uusimäki, A. ; Vähäkangas, J. / Laser soldering of flip-chips. In: Optics and Lasers in Engineering. 2006 ; Vol. 44, No. 2. pp. 112-121.
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