Integrated thermal management in system-on-package devices

György Bognár, Gábor Takács, Péter G. Szabó, Gábor Rózsás, László Pohl, Balázs Plesz

Research output: Article


Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

Original languageEnglish
Pages (from-to)200-210
Number of pages11
JournalPeriodica Polytechnica Electrical Engineering and Computer Science
Issue number2
Publication statusPublished - ápr. 15 2020

ASJC Scopus subject areas

  • Software
  • Signal Processing
  • Information Systems
  • Computer Science Applications
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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