In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies

Gabor Farkas, Juergen Zettner, Zoltan Sarkany, M. Rencz

Research output: Conference contribution

Abstract

In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature data on surfaces not accessible for direct measurements. The paper demonstrates simulation experiments on the feasibility of recognizing internal layers, and actual measurements on the change of TIMs in real power assemblies at priming (first powering event), run-in (early powering cycles) and curing at high temperature.

Original languageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
Volume2017-January
ISBN (Electronic)9781538619285
DOIs
Publication statusPublished - dec. 21 2017
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
Duration: szept. 27 2017szept. 29 2017

Other

Other23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
CountryNetherlands
CityAmsterdam
Period9/27/179/29/17

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Modelling and Simulation
  • Electrical and Electronic Engineering

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    Farkas, G., Zettner, J., Sarkany, Z., & Rencz, M. (2017). In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (Vol. 2017-January, pp. 1-6). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2017.8233799