Fast field solver programs for thermal and electrostatic analysis of microsystem elements

Research output: Conference contribution

3 Citations (Scopus)

Abstract

To solve the problem of fast thermal and electrostatic simulation of microsystem elements two different field solver tools have been developed at TUB. The μS-THERMANAL program is capable for the fast steady state and dynamic simulation of suspended multi-layered microsystem structures, while the 2D-SUNRED program is the first version of a general field solver program, based on an original method, the Successive Network Reduction. This program offers a very fast and accurate substitute of FEM programs for the solution of the Poisson equation, e.g. solving a 32000 grid problem in about 6 minutes on a 586 PC. Application examples show the usability of the tools.

Original languageEnglish
Title of host publicationIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers
Editors Anon
PublisherIEEE Comp Soc
Pages684-689
Number of pages6
Publication statusPublished - 1997
EventProceedings of the 1997 IEEE/ACM International Conference on Computer-Aided Design, ICCAD - San Jose, CA, USA
Duration: nov. 9 1997nov. 13 1997

Other

OtherProceedings of the 1997 IEEE/ACM International Conference on Computer-Aided Design, ICCAD
CitySan Jose, CA, USA
Period11/9/9711/13/97

Fingerprint

Microsystems
Electrostatics
Poisson equation
Finite element method
Computer simulation
Hot Temperature

ASJC Scopus subject areas

  • Software

Cite this

Székely, V., & Rencz, M. (1997). Fast field solver programs for thermal and electrostatic analysis of microsystem elements. In Anon (Ed.), IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers (pp. 684-689). IEEE Comp Soc.

Fast field solver programs for thermal and electrostatic analysis of microsystem elements. / Székely, V.; Rencz, M.

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers. ed. / Anon. IEEE Comp Soc, 1997. p. 684-689.

Research output: Conference contribution

Székely, V & Rencz, M 1997, Fast field solver programs for thermal and electrostatic analysis of microsystem elements. in Anon (ed.), IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers. IEEE Comp Soc, pp. 684-689, Proceedings of the 1997 IEEE/ACM International Conference on Computer-Aided Design, ICCAD, San Jose, CA, USA, 11/9/97.
Székely V, Rencz M. Fast field solver programs for thermal and electrostatic analysis of microsystem elements. In Anon, editor, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers. IEEE Comp Soc. 1997. p. 684-689
Székely, V. ; Rencz, M. / Fast field solver programs for thermal and electrostatic analysis of microsystem elements. IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers. editor / Anon. IEEE Comp Soc, 1997. pp. 684-689
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