Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

M. P Y Desmulliez, A. J. Pang, M. Leonard, R. S. Dhariwal, W. Yu, E. Abraham, Gy Bognár, A. Poppe, Gy Horvath, Zs Kohari, M. Rencz, D. Emerson, R. W. Barber, O. Slattery, F. Waldron, N. Cordero

Research output: Article

10 Citations (Scopus)

Abstract

The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-μm width and 70-μm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m2 K have been measured for a nitrogen flow rate of 120 l/h.

Original languageEnglish
Pages (from-to)20-29
Number of pages10
JournalIEEE Transactions on Components and Packaging Technologies
Volume32
Issue number1
DOIs
Publication statusPublished - 2009

Fingerprint

Microchannels
Cooling
Fabrication
Electroforming
Costs
Forced convection
Nickel
Heat resistance
Microelectronics
Heat transfer coefficients
Packaging
Nitrogen
Gases
Flow rate
Glass
Computer simulation
Testing
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate. / Desmulliez, M. P Y; Pang, A. J.; Leonard, M.; Dhariwal, R. S.; Yu, W.; Abraham, E.; Bognár, Gy; Poppe, A.; Horvath, Gy; Kohari, Zs; Rencz, M.; Emerson, D.; Barber, R. W.; Slattery, O.; Waldron, F.; Cordero, N.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, 2009, p. 20-29.

Research output: Article

Desmulliez, MPY, Pang, AJ, Leonard, M, Dhariwal, RS, Yu, W, Abraham, E, Bognár, G, Poppe, A, Horvath, G, Kohari, Z, Rencz, M, Emerson, D, Barber, RW, Slattery, O, Waldron, F & Cordero, N 2009, 'Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate', IEEE Transactions on Components and Packaging Technologies, vol. 32, no. 1, pp. 20-29. https://doi.org/10.1109/TCAPT.2008.2002434
Desmulliez, M. P Y ; Pang, A. J. ; Leonard, M. ; Dhariwal, R. S. ; Yu, W. ; Abraham, E. ; Bognár, Gy ; Poppe, A. ; Horvath, Gy ; Kohari, Zs ; Rencz, M. ; Emerson, D. ; Barber, R. W. ; Slattery, O. ; Waldron, F. ; Cordero, N. / Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate. In: IEEE Transactions on Components and Packaging Technologies. 2009 ; Vol. 32, No. 1. pp. 20-29.
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