Electrostatic force detection during anodic wafer bonding

Research output: Conference contribution

Abstract

This paper proposes a novel in situ monitoring method for anodic wafer bonding by measuring the evolving electrostatic force between the wafers during the bonding process. The genuine principle of the developed method is based on the direct detection of the electrostatic force compressing the wafers by measuring the resultant displacement of a proper silicon membrane structure. The membrane deformation is to be determined from the capacitance change of the structure formed by the flexible silicon and the fix metal electrode. In contrast to other experimental methods not only the resulted bonding strength could be studied posterior, but the entire process by this continuous in situ measurement. The methodology could significantly facilitate the comprehension of physical phenomena of the bonding process in correlation to the parameters (temperature, voltage bias, time) and establishing optimal conditions for particular structure development.

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors
DOIs
Publication statusPublished - 2012
Event11th IEEE SENSORS 2012 Conference - Taipei, Taiwan, Province of China
Duration: okt. 28 2012okt. 31 2012

Other

Other11th IEEE SENSORS 2012 Conference
CountryTaiwan, Province of China
CityTaipei
Period10/28/1210/31/12

Fingerprint

Wafer bonding
Electrostatic force
Silicon
Membrane structures
Bias voltage
Capacitance
Membranes
Electrodes
Monitoring
Metals
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Electrostatic force detection during anodic wafer bonding. / Kárpáti, T.; Pap, A.; Ádám, M.; Ferencz, J.; Fürjes, P.; Battistig, G.; Bársony, I.

Proceedings of IEEE Sensors. 2012. 6411331.

Research output: Conference contribution

Kárpáti, T, Pap, A, Ádám, M, Ferencz, J, Fürjes, P, Battistig, G & Bársony, I 2012, Electrostatic force detection during anodic wafer bonding. in Proceedings of IEEE Sensors., 6411331, 11th IEEE SENSORS 2012 Conference, Taipei, Taiwan, Province of China, 10/28/12. https://doi.org/10.1109/ICSENS.2012.6411331
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