Effects of flux residues on surface insulation resistance and electrochemical migration

Csaba Dominkovics, Gábor Harsányi

Research output: Conference contribution

16 Citations (Scopus)

Abstract

Two different types of fluxes - which are used mainly in wave soldering - were analyzed especially considering how they affect the reliability of electrical circuits. Flux residues mainly have effects on surface insulation resistance (SIR) and electrochemical migration (ECM). If we use fluxes without cleaning process after soldering, the residual organic and inorganic materials absorbed by the surface can extremely decrease the resistance between close running wires. This increases the probability of shortage and sparking. The fluxes were analyzed in freshly opened and aged state. The SIR was significantly larger when aged fluxes were used than in the case of newly opened specimens were applied. The electrochemical migration is one of the most important failure mechanisms in the field of printed wiring boards (PWB). The ECM is one of the most important physical-chemical processes, which limits the realization of fine pitch structures. We have carried out experiments on PWBs covered by different kind of no-clean fluxes in order to compare the mean time to failure of the migration process. The most important characteristics were examined by water drop tests. The experiments were executed by the aid of data acquisition device taking care of reproducibility. Test results demonstrate that the residual organic (or inorganic) materials can cause ionic induced migration and the failure rate can increase.

Original languageEnglish
Title of host publicationISSE 2006 - 29th International Spring Seminar on Electronics Technology
Subtitle of host publicationNano Technologies for Electronics Packaging, Conference Proceedings
Pages206-210
Number of pages5
DOIs
Publication statusPublished - dec. 1 2006
EventISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging - St. Marienthal, Germany
Duration: máj. 10 2006máj. 14 2006

Publication series

NameISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings

Other

OtherISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging
CountryGermany
CitySt. Marienthal
Period5/10/065/14/06

    Fingerprint

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Dominkovics, C., & Harsányi, G. (2006). Effects of flux residues on surface insulation resistance and electrochemical migration. In ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings (pp. 206-210). [4216027] (ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings). https://doi.org/10.1109/ISSE.2006.365387