Effect of ionic impurities on electrochemical migration failure reliability of microcircuits

Research output: Conference article

Abstract

Metals can exhibit dendritic short-circuits caused by electrochemical migration in conductor-insulator structures, which may result in failures and reliability problems in microcircuits. The classical model of electrochemical migration has been well known for several decades. This process is a transport of metal ions between two metallization stripes under bias through a continuous aqueous electrolyte. Due to the electrodeposition at the cathode, dendrites and dendrite-like deposits are formed Ultimately, such a deposit can lead to a short circuit in the device and can cause catastrophic failure. Surface contaminants, especially ionic types may have a significant influence on the overall process. Cl contaminant has been investigated extensively in various research works, however, many contradictory statements were published. The role of this type contaminants in influencing the formation of migrated resistive shorts is rather complicated. The different effects act against each other. Theoretical models and explanations are discussed in this paper. They are also strengthened by experimental results.

Original languageEnglish
Pages (from-to)597-602
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3582
Publication statusPublished - dec. 1 1998
EventProceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA
Duration: nov. 1 1998nov. 4 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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