Traditional board level thermal simulators provide temperature distribution on the board only. Recently developed simulators calculate exact junction temperatures obtained by the co-simulation of the detailed board model and the dynamic compact models of the devices the on board. The DELPHI project targeted the generation of steady-state compact models while the aim of the recent PROFIT project was the same for dynamic simulations. This paper tries to extend the DELPHI and PROFIT methodologies to allow completing dynamic compact models of device packages with compact models of cooling assemblies for the same purpose: co-simulation with the detailed board model. A few case studies are presented showing how such models can be constructed using structure functions and transient model fitting tools.
|Number of pages||8|
|Journal||Annual IEEE Semiconductor Thermal Measurement and Management Symposium|
|Publication status||Published - jan. 1 2003|
|Event||Nineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States|
Duration: márc. 11 2003 → márc. 13 2003
ASJC Scopus subject areas
- Electrical and Electronic Engineering