Contributions from thermal investigations of ICs and systems (THERMINIC)

Clemens J.M. Lasance, Marta Rencz

Research output: Editorial

Original languageEnglish
Pages (from-to)3-4
Number of pages2
JournalIEEE Transactions on Components and Packaging Technologies
Volume28
Issue number1
DOIs
Publication statusPublished - márc. 1 2005

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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