CAD tools for thermal testing of electronic systems

Vladimír Székely, Márta Rencz, Bernard Courtois

Research output: Article


Thermal simulation, measuring, modeling and testing of integrated circuits requires special CAD tools. A key problem of the thermal representation is the modeling of the IC chip and the package system. This paper focuses to the identification algorithm and the related modeling tool which is capable to generate automatically the compact model of thermal subsystems. The model generation is based on the thermal responses obtained either from thermal simulation using e.g. FEM tools or from measurements. Two important use of this method are presented in the paper: the application for the qualification and compact model generation of IC packages and for the package consideration and thermal transfer impedance modeling for electro-thermal simulation.

Original languageEnglish
Pages (from-to)2209-2215
Number of pages7
JournalAmerican Society of Mechanical Engineers, EEP
Issue number2
Publication statusPublished - dec. 1 1997

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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