In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.
|Number of pages||8|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - dec. 1 2007|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering