A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards

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16 Citations (Scopus)

Abstract

In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

Original languageEnglish
Pages (from-to)367-374
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number3
DOIs
Publication statusPublished - dec. 1 2007

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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