• 1266 Citations
  • 18 h-Index
1984 …2019
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Fingerprint Dive into the research topics where G. Harsányi is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 2 Similar Profiles
Soldering alloys Engineering & Materials Science
Thick films Engineering & Materials Science
Sensors Engineering & Materials Science
Soldering Engineering & Materials Science
Short circuit currents Engineering & Materials Science
Tin Engineering & Materials Science
Atmospheric humidity Engineering & Materials Science
Biosensors Engineering & Materials Science

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Research Output 1984 2019

  • 1266 Citations
  • 18 h-Index
  • 74 Article
  • 63 Conference contribution
  • 2 Chapter
  • 1 Book

Advances in pressure sensing for vapour phase soldering process monitoring

Alaya, M. A., Geczy, A., Illes, B., Harsányi, G. & Bušek, D., jan. 1 2019, In : Soldering and Surface Mount Technology.

Research output: Article

Process monitoring

Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

Straubinger, D., Géczy, A., Sipos, A., Kiss, A., Gyarmati, D., Krammer, O., Rigler, D., Bušek, D. & Harsányi, G., jan. 1 2019, In : Circuit World.

Research output: Article

Ball grid arrays
Surface mount technology
Current density
Printed circuit boards

Electrochemical Migration Investigations on SAC-Bi-xMn Solder Alloys

Medgyes, B., Román, E., Bohnert, Á., Szurdán, S., Zhong, X. & Harsányi, G., jan. 2 2019, 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, SIITME 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 80-83 4 p. 8599238. (2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, SIITME 2018 - Proceedings).

Research output: Conference contribution

Soldering alloys
drop tests
Atmospheric humidity