Yield enhancement by logi-thermal simulation based testing

Gergely Nagy, László Pohl, András Timár, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper proposes a method for yield enhancement in digital integrated circuit manufacture using a temperature dependent logic simulation tool. In an industrial environment the time slot dedicated to the logic testing of a single integrated circuit needs to be as short as possible in order to boost production. During this short period thermally induced errors might remain hidden due to long thermal time constants. This paper introduces a methodology to determine the steady-state die temperature where a short logic test is able to reveal logic faults. The evolved die temperature is simulated with a logi-thermal simulator engine that performs logic simulation by taking self-heating into account. We propose that the testing should take place at an elevated temperature where the temperature dependent failures arise. This approach makes it possible to detect otherwise hidden defects while keeping testing times short.

Original languageEnglish
Title of host publication18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
Pages196-199
Number of pages4
Publication statusPublished - 2012
Event18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 - Budapest, Hungary
Duration: Sep 25 2012Sep 27 2012

Other

Other18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
CountryHungary
CityBudapest
Period9/25/129/27/12

Fingerprint

Testing
Integrated circuit manufacture
Temperature
Digital integrated circuits
Integrated circuits
Simulators
Hot Temperature
Engines
Heating
Defects

Keywords

  • logic test
  • test automation
  • thermal aware

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Nagy, G., Pohl, L., Timár, A., & Poppe, A. (2012). Yield enhancement by logi-thermal simulation based testing. In 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 (pp. 196-199). [6400594]

Yield enhancement by logi-thermal simulation based testing. / Nagy, Gergely; Pohl, László; Timár, András; Poppe, A.

18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. p. 196-199 6400594.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nagy, G, Pohl, L, Timár, A & Poppe, A 2012, Yield enhancement by logi-thermal simulation based testing. in 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012., 6400594, pp. 196-199, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012, Budapest, Hungary, 9/25/12.
Nagy G, Pohl L, Timár A, Poppe A. Yield enhancement by logi-thermal simulation based testing. In 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. p. 196-199. 6400594
Nagy, Gergely ; Pohl, László ; Timár, András ; Poppe, A. / Yield enhancement by logi-thermal simulation based testing. 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. pp. 196-199
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