Worst case bin packing for OTN electrical layer networks dimensioning

Támas Király, Attila Bernáth, László Végh, Lajos Bajzik, Erika Kovács, Kristóf Bérczi, Alpár Jüttner, T. Jordán

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The OTN (Optical Transport Network) standard, defined by ITU-T Recommendation G.709 and G.872, contains a flexible digital hierarchy of ODU (Optical Data Unit) signals. The ODU hierarchy provides sub-wavelength grooming in OTN networks, which is necessary for efficient utilization of the high bit rates of optical channels. When dimensioning the links of a transport network consisting of ODU switches, the packing of lower order ODU signals into higher order ODU signals needs to be taken into account. These networks are expected to be controlled by GMPLS (Generalized MPLS), which puts specific constraints on the dimensioning. We assume that there is no explicit label control and that the GMPLS control plane is using first-fit strategy for making reservations on a link. With these assumptions the link dimensioning problem is defined as deciding how many higher order ODU component links are required on an OTN GMPLS bundled link for first-fit packing of a given set of lower order ODU demands, in any order of arrival. The paper provides strict bounds for ODU hierarchy-specific item and bin sizes. Then, it introduces an extended variant of the dimensioning problem, when lower order ODU connections which are not controlled by GMPLS are also present.

Original languageEnglish
Title of host publicationInternational Conference on Transparent Optical Networks
DOIs
Publication statusPublished - 2011
Event2011 13th International Conference on Transparent Optical Networks, ICTON 2011 - Stockholm, Sweden
Duration: Jun 26 2011Jun 30 2011

Other

Other2011 13th International Conference on Transparent Optical Networks, ICTON 2011
CountrySweden
CityStockholm
Period6/26/116/30/11

Fingerprint

Network layers
Bins
Labels
Switches
Wavelength

Keywords

  • GMPLS
  • maximum resource packing
  • OTN

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Király, T., Bernáth, A., Végh, L., Bajzik, L., Kovács, E., Bérczi, K., ... Jordán, T. (2011). Worst case bin packing for OTN electrical layer networks dimensioning. In International Conference on Transparent Optical Networks [5970778] https://doi.org/10.1109/ICTON.2011.5970778

Worst case bin packing for OTN electrical layer networks dimensioning. / Király, Támas; Bernáth, Attila; Végh, László; Bajzik, Lajos; Kovács, Erika; Bérczi, Kristóf; Jüttner, Alpár; Jordán, T.

International Conference on Transparent Optical Networks. 2011. 5970778.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Király, T, Bernáth, A, Végh, L, Bajzik, L, Kovács, E, Bérczi, K, Jüttner, A & Jordán, T 2011, Worst case bin packing for OTN electrical layer networks dimensioning. in International Conference on Transparent Optical Networks., 5970778, 2011 13th International Conference on Transparent Optical Networks, ICTON 2011, Stockholm, Sweden, 6/26/11. https://doi.org/10.1109/ICTON.2011.5970778
Király T, Bernáth A, Végh L, Bajzik L, Kovács E, Bérczi K et al. Worst case bin packing for OTN electrical layer networks dimensioning. In International Conference on Transparent Optical Networks. 2011. 5970778 https://doi.org/10.1109/ICTON.2011.5970778
Király, Támas ; Bernáth, Attila ; Végh, László ; Bajzik, Lajos ; Kovács, Erika ; Bérczi, Kristóf ; Jüttner, Alpár ; Jordán, T. / Worst case bin packing for OTN electrical layer networks dimensioning. International Conference on Transparent Optical Networks. 2011.
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