Whisker growth on annealed and recrystallized tin platings

Barbara Horváth, Balázs Illés, Tadashi Shinohara, G. Harsányi

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The aim of this research is to examine the effects of annealing and recrystallization of electroplated tin layers on mitigating the growth of tin whiskers. Tin plating electroplated on copper substrate has been tested. Three different groups of samples have been investigated: reference, annealed and recrystallized. Three types of ageing were being used to accelerate the whisker appearance: two life-like circumstances with a constant elevated temperature in low humidity and a temperature cycling test. The whisker growth was observed by using scanning electron microscopy and was evaluated by the average and maximum whisker length and the average whisker density. It is shown that at different ageing temperatures whisker appearance and growth are decreasing in aspect of the applied pre-treatments. The effects of the pre-treatments were explained by changes of the grain structure in the tin layer which were observed with focused ion beam.

Original languageEnglish
Pages (from-to)5733-5740
Number of pages8
JournalThin Solid Films
Volume520
Issue number17
DOIs
Publication statusPublished - Jun 30 2012

Fingerprint

Tinning
Tin
plating
tin
Aging of materials
pretreatment
Focused ion beams
Crystal microstructure
Temperature
Copper
Atmospheric humidity
Annealing
temperature
humidity
Scanning electron microscopy
ion beams
Substrates
copper
cycles
scanning electron microscopy

Keywords

  • Annealing
  • Electroplated tin
  • Recrystallization
  • Tin whisker

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Metals and Alloys
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Whisker growth on annealed and recrystallized tin platings. / Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi; Harsányi, G.

In: Thin Solid Films, Vol. 520, No. 17, 30.06.2012, p. 5733-5740.

Research output: Contribution to journalArticle

Horváth, Barbara ; Illés, Balázs ; Shinohara, Tadashi ; Harsányi, G. / Whisker growth on annealed and recrystallized tin platings. In: Thin Solid Films. 2012 ; Vol. 520, No. 17. pp. 5733-5740.
@article{15c0ce22fca9407c84e97955e898c0b3,
title = "Whisker growth on annealed and recrystallized tin platings",
abstract = "The aim of this research is to examine the effects of annealing and recrystallization of electroplated tin layers on mitigating the growth of tin whiskers. Tin plating electroplated on copper substrate has been tested. Three different groups of samples have been investigated: reference, annealed and recrystallized. Three types of ageing were being used to accelerate the whisker appearance: two life-like circumstances with a constant elevated temperature in low humidity and a temperature cycling test. The whisker growth was observed by using scanning electron microscopy and was evaluated by the average and maximum whisker length and the average whisker density. It is shown that at different ageing temperatures whisker appearance and growth are decreasing in aspect of the applied pre-treatments. The effects of the pre-treatments were explained by changes of the grain structure in the tin layer which were observed with focused ion beam.",
keywords = "Annealing, Electroplated tin, Recrystallization, Tin whisker",
author = "Barbara Horv{\'a}th and Bal{\'a}zs Ill{\'e}s and Tadashi Shinohara and G. Hars{\'a}nyi",
year = "2012",
month = "6",
day = "30",
doi = "10.1016/j.tsf.2012.03.130",
language = "English",
volume = "520",
pages = "5733--5740",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "17",

}

TY - JOUR

T1 - Whisker growth on annealed and recrystallized tin platings

AU - Horváth, Barbara

AU - Illés, Balázs

AU - Shinohara, Tadashi

AU - Harsányi, G.

PY - 2012/6/30

Y1 - 2012/6/30

N2 - The aim of this research is to examine the effects of annealing and recrystallization of electroplated tin layers on mitigating the growth of tin whiskers. Tin plating electroplated on copper substrate has been tested. Three different groups of samples have been investigated: reference, annealed and recrystallized. Three types of ageing were being used to accelerate the whisker appearance: two life-like circumstances with a constant elevated temperature in low humidity and a temperature cycling test. The whisker growth was observed by using scanning electron microscopy and was evaluated by the average and maximum whisker length and the average whisker density. It is shown that at different ageing temperatures whisker appearance and growth are decreasing in aspect of the applied pre-treatments. The effects of the pre-treatments were explained by changes of the grain structure in the tin layer which were observed with focused ion beam.

AB - The aim of this research is to examine the effects of annealing and recrystallization of electroplated tin layers on mitigating the growth of tin whiskers. Tin plating electroplated on copper substrate has been tested. Three different groups of samples have been investigated: reference, annealed and recrystallized. Three types of ageing were being used to accelerate the whisker appearance: two life-like circumstances with a constant elevated temperature in low humidity and a temperature cycling test. The whisker growth was observed by using scanning electron microscopy and was evaluated by the average and maximum whisker length and the average whisker density. It is shown that at different ageing temperatures whisker appearance and growth are decreasing in aspect of the applied pre-treatments. The effects of the pre-treatments were explained by changes of the grain structure in the tin layer which were observed with focused ion beam.

KW - Annealing

KW - Electroplated tin

KW - Recrystallization

KW - Tin whisker

UR - http://www.scopus.com/inward/record.url?scp=84861806752&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861806752&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2012.03.130

DO - 10.1016/j.tsf.2012.03.130

M3 - Article

AN - SCOPUS:84861806752

VL - 520

SP - 5733

EP - 5740

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 17

ER -