Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder

József Hlinka, Zsolt Fogarassy, Ágnes Cziráki, Zoltán Weltsch

Research output: Contribution to journalArticle


Effect of laser treatment has been studied on the wetting ability of Cu substrate during soldering with SAC305 solder paste. The contact angle of molten solder drops on Cu substrate changes when the substrates treated with different Nd:YAG laser powers. The correlations between the extraordinary change of wetting angle and the surface interaction between the melt pool of solder alloy and Cu plates are studied. A texture formation was found in the laser treated Cu substrate, which supports the diffusion of the Sn atoms. The thickness of Cu3Sn interface layer is increasing with increasing laser power helping the formation of Cu6Sn5 phase, and resulting a better metallic bonding in solder joints.

Original languageEnglish
Article number144127
JournalApplied Surface Science
Publication statusPublished - Jan 31 2020



  • Cu
  • Laser treatment
  • Nd:YAG
  • SAC solder
  • Wetting angle

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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