uS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCM's

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers, membranes have quite different heat transfer properties than the simple silicon cubes of conventional ICs. Furthermore numerous functions are realized on these structures based on thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable to simulate cantilever, bridge etc. microsystem structures both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsMichael T. Postek, Craig Friedrich
Pages64-75
Number of pages12
Publication statusPublished - Dec 1 1996
EventMicrolithography and Metrology in Micromachining II - Austin, TX, USA
Duration: Oct 14 1996Oct 15 1996

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume2880

Other

OtherMicrolithography and Metrology in Micromachining II
CityAustin, TX, USA
Period10/14/9610/15/96

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Szekely, V., Csendes, A., & Rencz, M. (1996). uS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCM's. In M. T. Postek, & C. Friedrich (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (pp. 64-75). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 2880).