Two-phase Taylor-flow reduced order thermal modeling

Merton Nemeth, Andras Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The paper presents a reduced order thermal model, which enables the thermal analysis of two-phase Taylor-flow. Two-phase Taylor flow is the basis of many microfluidic applications such as bio-chemical microreactors where segmented zones are required to accurately characterize enzyme reactions. This new model is represent a microtube with horizontally alternating and moving phases. The results obtained by the reduced order model match the results of a validated detailed Ansys-Fluent model with 5% accuracy at the channel wall. The reduced order model accounts for microcirculation and back flow. The proposed reduced order model of the two-phase Taylor-flow is foreseen to be included in in system level description of chemical microrectors.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015
EditorsGerold Schropfer, Francis Pressecq, Marta Rencz, Peter Schneider, Yoshio Mita, Benoit Charlot, Pascal Nouet
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479986255
DOIs
Publication statusPublished - Jul 16 2015
Event17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015 - Montpellier, France
Duration: Apr 27 2015Apr 30 2015

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015

Other

Other17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015
CountryFrance
CityMontpellier
Period4/27/154/30/15

Keywords

  • Calorimetry
  • Compact thermal modeling
  • Lab-on-a-Chip
  • segmented slug flow

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Nemeth, M., & Poppe, A. (2015). Two-phase Taylor-flow reduced order thermal modeling. In G. Schropfer, F. Pressecq, M. Rencz, P. Schneider, Y. Mita, B. Charlot, & P. Nouet (Eds.), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015 [7161025] (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2015.7161025