Transient reduced order thermal model of LEDs with phosphorous layer

Marton Nemeth, Zsolt Kohari, Janos Hegedus, Gusztav Hantos, Laszlo Pohl, Peter Palovics, Andras Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper an extension of SYSRED (SYstem function Successive network REDuction) simulation tool is presented to handle the heat generated in the phosphor layer of a phosphor converted white LED device. The heating effect of light conversion and the attenuation of light flux is taken into account through a resistance network between the source (LED chip) and the active converting nodes. With this tool, the transfer function network for the lens of a Cree XP-E LED device is created and reduced so as to connect it to a similarly reduced LED model. The results from the reduced order model show a good agreement compared to measurement data obtained for devices examined in the Delphi4LED project.

Original languageEnglish
Title of host publication2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728132860
DOIs
Publication statusPublished - May 2019
Event2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, France
Duration: May 12 2019May 15 2019

Publication series

Name2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Conference

Conference2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
CountryFrance
CityParis
Period5/12/195/15/19

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Keywords

  • LED modeling
  • network reduction
  • phosphor
  • reduced order modeling
  • transfer functions
  • white LED

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Nemeth, M., Kohari, Z., Hegedus, J., Hantos, G., Pohl, L., Palovics, P., & Poppe, A. (2019). Transient reduced order thermal model of LEDs with phosphorous layer. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 [8752937] (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2019.8752937