Transfer function order reducing method for successive network reduction in complex frequency space

Marton Nemeth, Peter Palovics, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper we present a direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. The paper describes a further reduction method in complex frequency space based on Hankel singular values. We tested the method on a typical MCPCB assembled LED structure in 2D. With that model we were able to comparise the results from analytical calculations and from that approximations. The results show that the approximation method is very accurate, the calculated error were below 2 %.

Original languageEnglish
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509043446
DOIs
Publication statusPublished - May 10 2017
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Dresden, Germany
Duration: Apr 3 2017Apr 5 2017

Other

Other18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
CountryGermany
CityDresden
Period4/3/174/5/17

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ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Electrical and Electronic Engineering
  • Modelling and Simulation
  • Numerical Analysis
  • Safety, Risk, Reliability and Quality

Cite this

Nemeth, M., Palovics, P., & Poppe, A. (2017). Transfer function order reducing method for successive network reduction in complex frequency space. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 [7926265] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE.2017.7926265