Tracing the thermal behavior of ICs

Vladimir Székely, Márta Rencz, Bernard Courtois

Research output: Contribution to journalReview article

27 Citations (Scopus)


Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs. Here, the authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability.

Original languageEnglish
Pages (from-to)14-21
Number of pages8
JournalIEEE Design and Test of Computers
Issue number2
Publication statusPublished - Apr 1 1998


ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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