To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15

Research output: Contribution to journalEditorial

Original languageEnglish
Pages (from-to)1
Number of pages1
JournalMicroelectronics Reliability
Volume67
DOIs
Publication statusPublished - Dec 1 2016

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Integrated circuits
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

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title = "To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15",
author = "M. Rencz",
year = "2016",
month = "12",
day = "1",
doi = "10.1016/j.microrel.2016.11.010",
language = "English",
volume = "67",
pages = "1",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",

}

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JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

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