Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes

Balázs Illés, Tadashi Shinohara, Barbara Horváth, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The aim of this research is to examine the whisker growth behaviour of tin-copper alloy surface finishes in highly oxidizing environment. Samples from copper base substrates were plated with 10 μm thick tin-copper alloys between 0 and 5 wt% copper content (with 1% steps) by solder dipping technology. Two types of aging were being used to accelerate the whisker appearance; these were an elevated humidity and temperature condition (85°C/85%RH) and a Highly Accelerated Stress Test (HAST 105°C/100%RH) up to 2400 hours in order to keep the samples in highly corrosion environment. The whisker growth was observed by using Scanning Electron Microscopy (SEM) and was evaluated by the morphology of the whiskers, by the average and maximum whisker length and the average whisker density. Results indicate differences in whisker growth depending on the test circumstances and on the copper content. The series of tests has shown that the different test circumstances induce different whiskering mechanisms and the significance in whisker formation of humidity and melting temperature of the plating alloy were also proven.

Original languageEnglish
Title of host publication2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings
Pages49-54
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Timisoara
Duration: Oct 20 2011Oct 23 2011

Other

Other2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011
CityTimisoara
Period10/20/1110/23/11

Fingerprint

Tin
Tin alloys
Copper
Copper alloys
Atmospheric humidity
Plating
Soldering alloys
Melting point
Aging of materials
Corrosion
Scanning electron microscopy
Substrates
Temperature

Keywords

  • humidity
  • oxidation
  • Sn-Cu alloy
  • surface finishes
  • tin whisker

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Polymers and Plastics

Cite this

Illés, B., Shinohara, T., Horváth, B., & Harsányi, G. (2011). Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes. In 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings (pp. 49-54). [6102681] https://doi.org/10.1109/SIITME.2011.6102681

Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes. / Illés, Balázs; Shinohara, Tadashi; Horváth, Barbara; Harsányi, G.

2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. p. 49-54 6102681.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Illés, B, Shinohara, T, Horváth, B & Harsányi, G 2011, Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes. in 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings., 6102681, pp. 49-54, 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011, Timisoara, 10/20/11. https://doi.org/10.1109/SIITME.2011.6102681
Illés B, Shinohara T, Horváth B, Harsányi G. Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes. In 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. p. 49-54. 6102681 https://doi.org/10.1109/SIITME.2011.6102681
Illés, Balázs ; Shinohara, Tadashi ; Horváth, Barbara ; Harsányi, G. / Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes. 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. pp. 49-54
@inproceedings{e9a8ffdc420140b386451b634af80746,
title = "Tin whisker growth from Sn-Cu (0-5 wt{\%}) surface finishes",
abstract = "The aim of this research is to examine the whisker growth behaviour of tin-copper alloy surface finishes in highly oxidizing environment. Samples from copper base substrates were plated with 10 μm thick tin-copper alloys between 0 and 5 wt{\%} copper content (with 1{\%} steps) by solder dipping technology. Two types of aging were being used to accelerate the whisker appearance; these were an elevated humidity and temperature condition (85°C/85{\%}RH) and a Highly Accelerated Stress Test (HAST 105°C/100{\%}RH) up to 2400 hours in order to keep the samples in highly corrosion environment. The whisker growth was observed by using Scanning Electron Microscopy (SEM) and was evaluated by the morphology of the whiskers, by the average and maximum whisker length and the average whisker density. Results indicate differences in whisker growth depending on the test circumstances and on the copper content. The series of tests has shown that the different test circumstances induce different whiskering mechanisms and the significance in whisker formation of humidity and melting temperature of the plating alloy were also proven.",
keywords = "humidity, oxidation, Sn-Cu alloy, surface finishes, tin whisker",
author = "Bal{\'a}zs Ill{\'e}s and Tadashi Shinohara and Barbara Horv{\'a}th and G. Hars{\'a}nyi",
year = "2011",
doi = "10.1109/SIITME.2011.6102681",
language = "English",
isbn = "9781457712753",
pages = "49--54",
booktitle = "2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings",

}

TY - GEN

T1 - Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes

AU - Illés, Balázs

AU - Shinohara, Tadashi

AU - Horváth, Barbara

AU - Harsányi, G.

PY - 2011

Y1 - 2011

N2 - The aim of this research is to examine the whisker growth behaviour of tin-copper alloy surface finishes in highly oxidizing environment. Samples from copper base substrates were plated with 10 μm thick tin-copper alloys between 0 and 5 wt% copper content (with 1% steps) by solder dipping technology. Two types of aging were being used to accelerate the whisker appearance; these were an elevated humidity and temperature condition (85°C/85%RH) and a Highly Accelerated Stress Test (HAST 105°C/100%RH) up to 2400 hours in order to keep the samples in highly corrosion environment. The whisker growth was observed by using Scanning Electron Microscopy (SEM) and was evaluated by the morphology of the whiskers, by the average and maximum whisker length and the average whisker density. Results indicate differences in whisker growth depending on the test circumstances and on the copper content. The series of tests has shown that the different test circumstances induce different whiskering mechanisms and the significance in whisker formation of humidity and melting temperature of the plating alloy were also proven.

AB - The aim of this research is to examine the whisker growth behaviour of tin-copper alloy surface finishes in highly oxidizing environment. Samples from copper base substrates were plated with 10 μm thick tin-copper alloys between 0 and 5 wt% copper content (with 1% steps) by solder dipping technology. Two types of aging were being used to accelerate the whisker appearance; these were an elevated humidity and temperature condition (85°C/85%RH) and a Highly Accelerated Stress Test (HAST 105°C/100%RH) up to 2400 hours in order to keep the samples in highly corrosion environment. The whisker growth was observed by using Scanning Electron Microscopy (SEM) and was evaluated by the morphology of the whiskers, by the average and maximum whisker length and the average whisker density. Results indicate differences in whisker growth depending on the test circumstances and on the copper content. The series of tests has shown that the different test circumstances induce different whiskering mechanisms and the significance in whisker formation of humidity and melting temperature of the plating alloy were also proven.

KW - humidity

KW - oxidation

KW - Sn-Cu alloy

KW - surface finishes

KW - tin whisker

UR - http://www.scopus.com/inward/record.url?scp=84855766098&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84855766098&partnerID=8YFLogxK

U2 - 10.1109/SIITME.2011.6102681

DO - 10.1109/SIITME.2011.6102681

M3 - Conference contribution

AN - SCOPUS:84855766098

SN - 9781457712753

SP - 49

EP - 54

BT - 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings

ER -