THERMOMECHANICAL STUDY OF HOT MELT ADHESIVES.

J. Karger-Kocsis, P. Hedvig

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Properties of six hot melt adhesives - five of which are based on ethylene-vinyl acetate copolyers and one of which is based on amorphous silica - are described. The author presents detailed information on experimental procedure and results. A quantitative mini-computer controlled thermomechanical method is offered for the quality control of hot melt adhesives. By phase analysis incoming materials can be identified and important quality parameters can be derived as the ratio of the plastic to elastic moduli in the working temperature range, the lowest and highest transition temperature, and adhesion to various substrates.

Original languageEnglish
Pages (from-to)24-28
Number of pages5
JournalAdhesives Age
Volume24
Issue number7
Publication statusPublished - Jul 1981

Fingerprint

Hot melt adhesives
Silicon Dioxide
Superconducting transition temperature
Quality control
Ethylene
Adhesion
Elastic moduli
Silica
Plastics
Substrates
Temperature
vinyl acetate
ethylene

ASJC Scopus subject areas

  • Chemical Engineering(all)

Cite this

THERMOMECHANICAL STUDY OF HOT MELT ADHESIVES. / Karger-Kocsis, J.; Hedvig, P.

In: Adhesives Age, Vol. 24, No. 7, 07.1981, p. 24-28.

Research output: Contribution to journalArticle

Karger-Kocsis, J & Hedvig, P 1981, 'THERMOMECHANICAL STUDY OF HOT MELT ADHESIVES.', Adhesives Age, vol. 24, no. 7, pp. 24-28.
Karger-Kocsis, J. ; Hedvig, P. / THERMOMECHANICAL STUDY OF HOT MELT ADHESIVES. In: Adhesives Age. 1981 ; Vol. 24, No. 7. pp. 24-28.
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