THERMODEL: A tool for thermal model generation, and application for MEMS packages

Research output: Contribution to journalConference article

5 Citations (Scopus)

Abstract

This paper presents a tool and a method for the generation of reduced order thermal models, in order to assure modeling the effect of the package on the thermal behavior of the packaged device. The method is generic, and can be based either on the simulated or on the measured thermal transient response of the real packages. It is based on the generation of the time constant density spectrum of the thermal response function, from which we automatically generate a reduced order thermal model in the form of an RC ladder network model. Beyond presenting the generic methodology experimental results are also presented, based both on the simulation and measurement of MEMS elements and packages.

Original languageEnglish
Pages (from-to)39-49
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4019
Publication statusPublished - Jan 1 2000
EventDesign, Test, Integration, and Packaging of MEMS/MOEMS - Paris, Fr
Duration: May 9 2000May 11 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'THERMODEL: A tool for thermal model generation, and application for MEMS packages'. Together they form a unique fingerprint.

  • Cite this