THERMAN: A thermal simulation tool for IC chips, microstructures and PW boards

Vladimír Székely, András Poppe, Márta Rencz, Miklós Rosental, Tamás Teszéri

Research output: Contribution to journalArticle

39 Citations (Scopus)

Abstract

This article presents THERMAN: the renewed version of the μS-THERMANAL simulation program. The program was rewritten last year, in order to include algorithmic novelties such as time-constant analysis. The new code is fully transportable providing the same user interface on PCs and on Unix-based workstations. The graphical interface allows a fast problem definition and easy, many-sided evaluation of the results.

Original languageEnglish
Pages (from-to)517-524
Number of pages8
JournalMicroelectronics Reliability
Volume40
Issue number3
DOIs
Publication statusPublished - Mar 17 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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