Thermal transient testing of packages without a tester

V. Székely, M. Rencz, Bernard Courtois

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Thermal transient testing is an excellent method to measure the thermal properties of packages, to check die attach quality and to detect and localize physical defects in the heat removing path. The measured transient responses are also the bases of compact, dynamic thermal model generation. The measuring set-up for the thermal transient experiments is rather complex, including expensive dedicated equipment. The purpose of this paper is to present an alternative solution for the thermal transient testing which eliminates the need of the expensive hardware equipment. A method for compact thermal model generation is also provided.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
PublisherIEEE
Pages236-239
Number of pages4
Publication statusPublished - 1998
EventProceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98) - Singapore, Singapore
Duration: Dec 8 1998Dec 10 1998

Other

OtherProceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98)
CitySingapore, Singapore
Period12/8/9812/10/98

Fingerprint

Testing
Transient analysis
Hot Temperature
Thermodynamic properties
Hardware
Defects
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Székely, V., Rencz, M., & Courtois, B. (1998). Thermal transient testing of packages without a tester. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 236-239). IEEE.

Thermal transient testing of packages without a tester. / Székely, V.; Rencz, M.; Courtois, Bernard.

Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 1998. p. 236-239.

Research output: Chapter in Book/Report/Conference proceedingChapter

Székely, V, Rencz, M & Courtois, B 1998, Thermal transient testing of packages without a tester. in Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, pp. 236-239, Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98), Singapore, Singapore, 12/8/98.
Székely V, Rencz M, Courtois B. Thermal transient testing of packages without a tester. In Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE. 1998. p. 236-239
Székely, V. ; Rencz, M. ; Courtois, Bernard. / Thermal transient testing of packages without a tester. Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 1998. pp. 236-239
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