Thermal transient testing

Gábor Farkas, Tomoaki Hara, Márta Rencz

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

In this chapter, the basics of thermal transient testing are presented, with examples of thermal analysis using structure function evaluation. The specialties of thermal transient testing on wide bandgap semiconductors are also described.

Original languageEnglish
Title of host publicationWide Bandgap Power Semiconductor Packaging
Subtitle of host publicationMaterials, Components, and Reliability
PublisherElsevier
Pages127-153
Number of pages27
ISBN (Electronic)9780081020944
ISBN (Print)9780081020951
DOIs
Publication statusPublished - Jan 1 2018

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Keywords

  • Bandgap semiconductors
  • GaN
  • SiC
  • Structure functions
  • Thermal analysis
  • Thermal transient testing
  • TIM layer
  • Z curves

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this

Farkas, G., Hara, T., & Rencz, M. (2018). Thermal transient testing. In Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (pp. 127-153). Elsevier. https://doi.org/10.1016/B978-0-08-102094-4.00008-6