Thermal Transient Testing

V. Székely, M. Rencz, B. Courtois

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.

Original languageEnglish
JournalMicroelectronics International
Volume14
Issue number2
Publication statusPublished - May 1997

Fingerprint

Testing
packaging
integrated circuits
Integrated circuits
scaling
Packaging
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Thermal Transient Testing. / Székely, V.; Rencz, M.; Courtois, B.

In: Microelectronics International, Vol. 14, No. 2, 05.1997.

Research output: Contribution to journalArticle

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