Thermal transient evaluation of packages with the TTMK toolkit

Vladimír Székely, Márta Rencz, Bernard Courtois

Research output: Contribution to conferencePaper

Abstract

This paper presents a new concept for the thermal transient measurement of IC packages. The TTMK thermal transient test kit described here consists of a test chip, a dedicated software running on a PC and a special cable connecting the PC to the IC package which encapsulates the test chip. The function of the thermal transient test equipment is realized partly by the test chip itself and partly by the measuring software. The software performs both the control of the measurement and the evaluation of the results. The output of the evaluation software may be a compact model network or the structure function describing the properties of the heat conduction path. The use of the TTMK kit and the capabilities of the evaluation software are presented in the paper.

Original languageEnglish
Pages2/-
Publication statusPublished - Dec 1 1999
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: Jun 13 1999Jun 19 1999

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period6/13/996/19/99

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Székely, V., Rencz, M., & Courtois, B. (1999). Thermal transient evaluation of packages with the TTMK toolkit. 2/-. Paper presented at InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', Maui, HI, USA, .