Thermal testing methods to increase system reliability

V. Szekely, M. Rencz, B. Courtois

Research output: Contribution to journalConference article

14 Citations (Scopus)


Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper newly developed design and testing methods are presented. The SISSSI electro-thermal simulator predicts the layout dependent electro-thermal behaviour of circuits. The presented CMOS temperature sensors and the idea of DfTT designs assure on-line temperature monitoring of circuits and packages. The also presented thermal transient testing method enables accurate thermal characterization of packages both for design and verification purposes. The capabilities of the new tools are demonstrated with application examples.

Original languageEnglish
Pages (from-to)210-217
Number of pages8
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Publication statusPublished - Jan 1 1997
EventProceedings of the 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium - Austin, TX, USA
Duration: Jan 28 1997Jan 30 1997

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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