Thermal test and monitoring

Vladimír Szély, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We present possible solutions for the life-time th.erma1 monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device insertion of one or more temperature sensors is proposed. A new-concept temperature sensor element is introduced: The thermal-feedback oscillator (TFO). The TFO has digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as the boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented 2.

Original languageEnglish
Title of host publicationProceedings of the 1995 European Conference on Design and Test, EDTC 1995
PublisherAssociation for Computing Machinery, Inc
Number of pages1
ISBN (Electronic)0818670398, 9780818670398
Publication statusPublished - Mar 6 1995
Event1995 European Conference on Design and Test, EDTC 1995 - Paris, France
Duration: Mar 6 1995Mar 9 1995

Other

Other1995 European Conference on Design and Test, EDTC 1995
CountryFrance
CityParis
Period3/6/953/9/95

Fingerprint

Temperature sensors
Monitoring
Feedback
Microelectronics
Hot Temperature
Networks (circuits)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Szély, V., & Rencz, M. (1995). Thermal test and monitoring. In Proceedings of the 1995 European Conference on Design and Test, EDTC 1995 Association for Computing Machinery, Inc.

Thermal test and monitoring. / Szély, Vladimír; Rencz, M.

Proceedings of the 1995 European Conference on Design and Test, EDTC 1995. Association for Computing Machinery, Inc, 1995.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Szély, V & Rencz, M 1995, Thermal test and monitoring. in Proceedings of the 1995 European Conference on Design and Test, EDTC 1995. Association for Computing Machinery, Inc, 1995 European Conference on Design and Test, EDTC 1995, Paris, France, 3/6/95.
Szély V, Rencz M. Thermal test and monitoring. In Proceedings of the 1995 European Conference on Design and Test, EDTC 1995. Association for Computing Machinery, Inc. 1995
Szély, Vladimír ; Rencz, M. / Thermal test and monitoring. Proceedings of the 1995 European Conference on Design and Test, EDTC 1995. Association for Computing Machinery, Inc, 1995.
@inproceedings{c20f5348f1a143cda6101bac2b9de1f5,
title = "Thermal test and monitoring",
abstract = "We present possible solutions for the life-time th.erma1 monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device insertion of one or more temperature sensors is proposed. A new-concept temperature sensor element is introduced: The thermal-feedback oscillator (TFO). The TFO has digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as the boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented 2.",
author = "Vladim{\'i}r Sz{\'e}ly and M. Rencz",
year = "1995",
month = "3",
day = "6",
language = "English",
booktitle = "Proceedings of the 1995 European Conference on Design and Test, EDTC 1995",
publisher = "Association for Computing Machinery, Inc",

}

TY - GEN

T1 - Thermal test and monitoring

AU - Szély, Vladimír

AU - Rencz, M.

PY - 1995/3/6

Y1 - 1995/3/6

N2 - We present possible solutions for the life-time th.erma1 monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device insertion of one or more temperature sensors is proposed. A new-concept temperature sensor element is introduced: The thermal-feedback oscillator (TFO). The TFO has digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as the boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented 2.

AB - We present possible solutions for the life-time th.erma1 monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device insertion of one or more temperature sensors is proposed. A new-concept temperature sensor element is introduced: The thermal-feedback oscillator (TFO). The TFO has digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as the boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented 2.

UR - http://www.scopus.com/inward/record.url?scp=30244482562&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=30244482562&partnerID=8YFLogxK

M3 - Conference contribution

BT - Proceedings of the 1995 European Conference on Design and Test, EDTC 1995

PB - Association for Computing Machinery, Inc

ER -