Thermal stability of nanoscale metallic multilayers

A. S. Ramos, A. J. Cavaleiro, M. T. Vieira, J. Morgiel, G. Sáfrán

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Metallic nanolayered thin films/foils, in particular Ni/Al multilayers, have been used to promote joining. The objective of this work is to evaluate the thermal stability of nanoscale metallic multilayers with potential for joining applications. Multilayers thin films with low (Ti/Al and Ni/Ti), medium (Ni/Al) and high (Pd/Al) enthalpies of exothermic reaction were prepared by dual cathode magnetron sputtering. Their thermal stability was studied by: i) differential scanning calorimetry combined with X-ray diffraction (XRD), ii) in-situ XRD using cobalt radiation, and iii) in-situ transmission electron microscopy. It was possible to detect traces of intermetallic or amorphous phases in the as-deposited short period (bilayer thickness) multilayers, except for the Ti/Al films where no reaction products that might be formed during deposition were identified. For short periods (below 20 nm) the equilibrium phases are directly achieved upon annealing, whereas for higher periods intermediate trialuminide phases are present for Ti/Al and Ni/Al multilayers. The formation of B2-NiTi from Ni/Ti multilayers occurs without the formation of intermediate phases. On the contrary, for the Pd-Al system the formation of intermediate phases was never avoided. The viability of nanoscale multilayers as "filler" materials for joining macro or microparts/devices was demonstrated.

Original languageEnglish
Pages (from-to)268-274
Number of pages7
JournalThin Solid Films
Volume571
Issue numberP2
DOIs
Publication statusPublished - Nov 28 2014

Fingerprint

Multilayers
Thermodynamic stability
thermal stability
Joining
exothermic reactions
thin films
fillers
diffraction
viability
reaction products
intermetallics
foils
magnetron sputtering
x rays
cobalt
heat measurement
cathodes
enthalpy
X ray diffraction
Thin films

Keywords

  • Intermetallic
  • Multilayers
  • Ni/Al
  • Ni/Ti
  • Pd/Al
  • Sputtering
  • Thermal stability
  • Ti/Al

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Metals and Alloys
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Ramos, A. S., Cavaleiro, A. J., Vieira, M. T., Morgiel, J., & Sáfrán, G. (2014). Thermal stability of nanoscale metallic multilayers. Thin Solid Films, 571(P2), 268-274. https://doi.org/10.1016/j.tsf.2014.05.065

Thermal stability of nanoscale metallic multilayers. / Ramos, A. S.; Cavaleiro, A. J.; Vieira, M. T.; Morgiel, J.; Sáfrán, G.

In: Thin Solid Films, Vol. 571, No. P2, 28.11.2014, p. 268-274.

Research output: Contribution to journalArticle

Ramos, AS, Cavaleiro, AJ, Vieira, MT, Morgiel, J & Sáfrán, G 2014, 'Thermal stability of nanoscale metallic multilayers', Thin Solid Films, vol. 571, no. P2, pp. 268-274. https://doi.org/10.1016/j.tsf.2014.05.065
Ramos, A. S. ; Cavaleiro, A. J. ; Vieira, M. T. ; Morgiel, J. ; Sáfrán, G. / Thermal stability of nanoscale metallic multilayers. In: Thin Solid Films. 2014 ; Vol. 571, No. P2. pp. 268-274.
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