Thermal qualification of 3D stacked die structures

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages. A methodology is suggested for the transient compact modeling of stacked die structures.

Original languageEnglish
Title of host publicationBEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference
Pages23-30
Number of pages8
DOIs
Publication statusPublished - Dec 1 2006
EventBEC 2006 - 2006 International Baltic Electronics Conference; 10th Biennial Batic Electronics Conference - Tallinn, Estonia
Duration: Oct 2 2006Oct 4 2006

Publication series

NameBEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference

Other

OtherBEC 2006 - 2006 International Baltic Electronics Conference; 10th Biennial Batic Electronics Conference
CountryEstonia
CityTallinn
Period10/2/0610/4/06

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Rencz, M. (2006). Thermal qualification of 3D stacked die structures. In BEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference (pp. 23-30). [4100273] (BEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference). https://doi.org/10.1109/BEC.2006.311052