Thermal qualification of 3D stacked die packages

M. Rencz, G. Farkas, V. Székely, A. Poppe, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper measurement experiments prove that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s), even in case of stacked die packages. Both the strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The paper summarizes shortly the theoretical background of the method, and presents the use of the methodology with several measured examples. With the help of the presented correction procedure even the accurate values of the thermal layer parameters, such as thermal resistances or capacitances may be determined with the discussed thermal qualification methodology.

Original languageEnglish
Title of host publicationProceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
EditorsK.C. Toh, Y.C. Mui, J. How, J.H.L. Pang
Pages30-35
Number of pages6
Publication statusPublished - Dec 1 2004
Event6th Electronics Packaging Technology Conference, EPTC 2004 - Singapore, Singapore
Duration: Dec 8 2005Dec 10 2005

Publication series

NameProceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Other

Other6th Electronics Packaging Technology Conference, EPTC 2004
CountrySingapore
CitySingapore
Period12/8/0512/10/05

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Thermal qualification of 3D stacked die packages'. Together they form a unique fingerprint.

  • Cite this

    Rencz, M., Farkas, G., Székely, V., Poppe, A., & Courtois, B. (2004). Thermal qualification of 3D stacked die packages. In K. C. Toh, Y. C. Mui, J. How, & J. H. L. Pang (Eds.), Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 (pp. 30-35). [A2.1] (Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004).