This paper presents possible solutions for the lifetime thermal monitoring of microelectronic structures. To capture the detailed thermal state of an encapsulated device, insertion of a number of temperature sensors is proposed. A new temperature sensor element is introduced: the thermal-feedback oscillator (TFO). This temperature sensor has a digital output signal, and is therefore suitable for integration with other built-in test circuits such as the boundary scan. The paper investigates the feasibility of the TFO temperature sensor.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering