Thermal monitoring of microelectronic structures

Research output: Contribution to journalArticle

38 Citations (Scopus)

Abstract

This paper presents possible solutions for the lifetime thermal monitoring of microelectronic structures. To capture the detailed thermal state of an encapsulated device, insertion of a number of temperature sensors is proposed. A new temperature sensor element is introduced: the thermal-feedback oscillator (TFO). This temperature sensor has a digital output signal, and is therefore suitable for integration with other built-in test circuits such as the boundary scan. The paper investigates the feasibility of the TFO temperature sensor.

Original languageEnglish
Pages (from-to)157-170
Number of pages14
JournalMicroelectronics Journal
Volume25
Issue number3
DOIs
Publication statusPublished - May 1994

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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