Thermal monitoring of memories

V. Székely, M. Rencz, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

3D packaging of memories, downscaling of the memory chips populating these packages, make thermal issues more and more serious. The goal of this paper is to propose means to detect potential problems and to suggest how to include these mechanisms in the general framework of the design of such systems.

Original languageEnglish
Title of host publicationRecords of the 1996 IEEE International Workshop on Memory Technology, Design and Testing, MTDT 1996
EditorsYong-Khim Swee, Rochit Rajsuman, Lee-Yee Lau
PublisherIEEE Computer Society
Pages86-91
Number of pages6
ISBN (Electronic)0818674687
DOIs
Publication statusPublished - Jan 1 1996
Event1996 IEEE International Workshop on Memory Technology, Design and Testing, MTDT 1996 - Singapore, Singapore
Duration: Aug 13 1996Aug 14 1996

Publication series

NameRecords of the IEEE International Workshop on Memory Technology, Design and Testing
ISSN (Print)1087-4852

Conference

Conference1996 IEEE International Workshop on Memory Technology, Design and Testing, MTDT 1996
CountrySingapore
CitySingapore
Period8/13/968/14/96

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ASJC Scopus subject areas

  • Media Technology

Cite this

Székely, V., Rencz, M., & Courtois, B. (1996). Thermal monitoring of memories. In Y-K. Swee, R. Rajsuman, & L-Y. Lau (Eds.), Records of the 1996 IEEE International Workshop on Memory Technology, Design and Testing, MTDT 1996 (pp. 86-91). [782497] (Records of the IEEE International Workshop on Memory Technology, Design and Testing). IEEE Computer Society. https://doi.org/10.1109/MTDT.1996.782497