Thermal modelling of multiple die packages

P. Szabo, M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Various aspects of the dynamic thermal modelling of multiple die packages are discussed it the paper. After a short literature review of the subject the structure function based thermal modelling is presented briefly with an example that was measured in a package, containing stacked dies. The second part of the paper present the new concept of multiport modelling of multiple die packages, where each port is assigned to a die in the package. We demonstrate with experimental results, that the proposed frequency dependent Zth thermal impedance matrix representation of the multiple die packages provides a very informative characterisation of the dynamic thermal behaviour of these packages.

Original languageEnglish
Title of host publicationProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Pages521-525
Number of pages5
Publication statusPublished - Dec 1 2005
Event7th Electronics Packaging Technology Conference, EPTC 2005 - Singapore, Singapore
Duration: Dec 7 2005Dec 9 2005

Publication series

NameProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Volume2

Other

Other7th Electronics Packaging Technology Conference, EPTC 2005
CountrySingapore
CitySingapore
Period12/7/0512/9/05

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Szabo, P., Rencz, M., Székely, V., Poppe, A., Farkas, G., & Courtois, B. (2005). Thermal modelling of multiple die packages. In Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 (pp. 521-525). [1614459] (Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005; Vol. 2).