Thermal issues in stacked die packages

Research output: Chapter in Book/Report/Conference proceedingConference contribution

29 Citations (Scopus)

Abstract

After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages.

Original languageEnglish
Title of host publicationAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages307-312
Number of pages6
DOIs
Publication statusPublished - 2005
Event21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States
Duration: Mar 15 2005Mar 17 2005

Other

Other21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium
CountryUnited States
CitySan Jose, CA
Period3/15/053/17/05

Fingerprint

qualifications
failure analysis
Failure analysis
Hot Temperature

Keywords

  • Dies attach qualification
  • Package thermal qualification
  • Stacked dies
  • Thermal transient measurements

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Rencz, M. (2005). Thermal issues in stacked die packages. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium (pp. 307-312) https://doi.org/10.1109/STHERM.2005.1412197

Thermal issues in stacked die packages. / Rencz, M.

Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2005. p. 307-312.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M 2005, Thermal issues in stacked die packages. in Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 307-312, 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, United States, 3/15/05. https://doi.org/10.1109/STHERM.2005.1412197
Rencz M. Thermal issues in stacked die packages. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2005. p. 307-312 https://doi.org/10.1109/STHERM.2005.1412197
Rencz, M. / Thermal issues in stacked die packages. Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2005. pp. 307-312
@inproceedings{77c255e2ef3b4ab6a30dacd04292af6b,
title = "Thermal issues in stacked die packages",
abstract = "After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages.",
keywords = "Dies attach qualification, Package thermal qualification, Stacked dies, Thermal transient measurements",
author = "M. Rencz",
year = "2005",
doi = "10.1109/STHERM.2005.1412197",
language = "English",
isbn = "0780389859",
pages = "307--312",
booktitle = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

}

TY - GEN

T1 - Thermal issues in stacked die packages

AU - Rencz, M.

PY - 2005

Y1 - 2005

N2 - After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages.

AB - After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages.

KW - Dies attach qualification

KW - Package thermal qualification

KW - Stacked dies

KW - Thermal transient measurements

UR - http://www.scopus.com/inward/record.url?scp=28144459360&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=28144459360&partnerID=8YFLogxK

U2 - 10.1109/STHERM.2005.1412197

DO - 10.1109/STHERM.2005.1412197

M3 - Conference contribution

SN - 0780389859

SP - 307

EP - 312

BT - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

ER -