Thermal investigations of integrated circuits in systems at THERMINIC'07

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)1366
Number of pages1
JournalMicroelectronics Journal
Volume40
Issue number9
DOIs
Publication statusPublished - Sep 2009

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integrated circuits
Integrated circuits
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Thermal investigations of integrated circuits in systems at THERMINIC'07. / Rencz, M.

In: Microelectronics Journal, Vol. 40, No. 9, 09.2009, p. 1366.

Research output: Contribution to journalArticle

@article{23b133544bb24d1c8730ec1298767cfa,
title = "Thermal investigations of integrated circuits in systems at THERMINIC'07",
author = "M. Rencz",
year = "2009",
month = "9",
doi = "10.1016/j.mejo.2008.08.019",
language = "English",
volume = "40",
pages = "1366",
journal = "Microelectronics",
issn = "0026-2692",
publisher = "Elsevier Limited",
number = "9",

}

TY - JOUR

T1 - Thermal investigations of integrated circuits in systems at THERMINIC'07

AU - Rencz, M.

PY - 2009/9

Y1 - 2009/9

UR - http://www.scopus.com/inward/record.url?scp=69249214077&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=69249214077&partnerID=8YFLogxK

U2 - 10.1016/j.mejo.2008.08.019

DO - 10.1016/j.mejo.2008.08.019

M3 - Article

VL - 40

SP - 1366

JO - Microelectronics

JF - Microelectronics

SN - 0026-2692

IS - 9

ER -