Thermal investigations of integrated circuits and systems, THERMINIC'16

Research output: Contribution to journalEditorial

Original languageEnglish
Number of pages1
JournalMicroelectronics Reliability
Volume79
DOIs
Publication statusPublished - Dec 1 2017

Fingerprint

Integrated circuits
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Thermal investigations of integrated circuits and systems, THERMINIC'16. / Rencz, M.

In: Microelectronics Reliability, Vol. 79, 01.12.2017.

Research output: Contribution to journalEditorial

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